Shanghai Sepna Chemical Technology

#Product Description<br />
SE2205 is two-component solvent-free room temperature curing epoxy potting adhesive with good thermal conductivity.<br />
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#Key Features<br />
1.Good toughness, high hardness<br />
2.Excellent adhesion, anti-cracking property<br />
3.Excellent electrical insulating properties, and stability<br />
4.Good waterproof, moisture resistance, very low water absorption<br />
5.Good temperature resistance, with 0.9 W/mK thermal conductivity<br />
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#Typical Applications<br />
For potting protection of high-power electronic components, modules, electric tools, instrumentation, automotive electronics and circuits boards which require high thermal conductivity.<br />
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#Directions for Use<br />
1.Stirring A component evenly before taking use.<br />
2.Mix A, B two components with 5:1 mass ratio, stir well and do vacuum defoaming before potting to components.<br />
3.If necessary, continue to vacuum defoaming for components which been potted, help to increase the electrical performance of the device.<br />
4.Curing conditions: Preliminary curing time is 8 hours at room temperature, completely cured need 24 hours; also can be heat curing, in 80°C for 2~3 hours.<br />
5.The above tests are measured under 120g mixture of adhesive.<br />
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MORE PRODUCT INFORMATION AT OUR SITE WWW.SEPNA.CC, EMAIL TO [email protected]<br />
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