Shenzhen PEAK Technology Co., Ltd

Up to 64 Layers
FR4 TG135/TG150/TG170
Halogen Free/CTI≥600
Aspect Ratio (Finish Hole) 28:1
Sample Expedited 8 Hours(1-2Layer)

Blind/Buried Via
5+N(N+M)+5 Structure
Trace Width/Spacing 1.6/1.6mil
Laser Hole Size(mm)≥0.075
High Density Interconnector

More than 85+ Types
Rogers/Arlon/Taconic/Isola/
Nelco/F4B Serices,etc
Materials can be Specified
Impedance Tolerance ±5%(min)

Panasonic Megtron4/6/7
TU-872SLK/Isola-FR408HR,etc
Impedance Tolerance ±5%(min)
Dimension Accuracy ±0.02mm(min)
Line Width/Space Accuracy ±5%

Thermal Conductivity 1-398W/m.K
Aluminum/Copper AC 500-4000V
Post-bonding/Pre-bonding
Sweat-Soldering/Conductive Adhesive
Press-Fit/Embedded Coin(I, T U)

2-24 Layers
Book/Air-gap/Fly-tail
Unsymmetrical/Semi-Flex
Width of Flexible Zone 3mm(min)
Dimension Accuracy ±0.05mm(min)

CSP/FC-CSP/SIP/FC-BGA/WB-CSP
FR4/BT/High-Speed Material
Trace Width/Space 12/12μm
SM Registration:±20μm
Strict SM Flatness Control ≤5μm

Ceramic/Glass Material
Hybrid Material Lamination
Buried Capacitance/Resistance
PTH/NPTH Step Slots
Uneven/Segmented/Step Gold Finger

Founded in 2007, PEAK Co.,Ltd is an electronic solutions company offering 1-64 layers PCB fabrication, assembly, testing & validation of rigid, rigid-flex, HDI, high frequency, high speed, metal core, IC substrate, substrate-like and other special PCB. Our modern 54,000 square foot manufacturing facility allows us to provide all rigid & rigid-flex services under one roof and offer quick-turn capabilities. PEAK has a professional reputation for developing high-performance solutions for technically advanced OEM's in a variety of markets including aerospace and defense, medical, computer, communication, server, semiconductor IC, automotives, industrial control, optoelectronics, LED and others.